Solder paste 50g lead free

Lödpasta (blyfri) i 10cc doseringsspruta.

Specifikationer:
Metal components: Sn 96,5 / Ag 3,0 / Cu 0,5
Solder constituent parts/particle size: 25-36µm
Melting point: 217°C
Proportion of flux: 10,5 - 12,5 %
Copper: none
Halogen content: none
Insulation resistance:1 x 1012 Ohm
Utilisation time: 24 hours
Flow rate: 90