In the manufacturing of printed circuit boards (PCBs), a laminate made of insulating material is used, typically FR2 (phenolic paper) or FR4 (glass fiber epoxy), coated with a thin layer of copper – usually 35 µm thick. The laminate itself is approximately 1.5 mm thick. In certain applications, such as power electronics, thicker copper is used to handle higher currents.
To create the circuit pattern, the copper surface is coated with a light-sensitive layer called photoresist, which reacts to UV light in the wavelength range of 360–400 nm (UV-A). Both positive and negative photoresist types exist, but positive resist is most commonly used in PCB manufacturing.
A positive film containing the circuit pattern is placed on top of the board and exposed to UV light. Where the light hits, the photoresist becomes soluble and is washed away in the developer. The remaining resist protects the copper during etching, so that only the unwanted copper is removed. The result is a pattern of conductive traces on the insulating surface.
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