Product description
Heat sink made of black anodized aluminium with pre-applied thermally conductive tape for easy mounting on semiconductor devices. The tape acts as a thermal interface between the device and the heat sink and provides good thermal conductivity as well as cushioning and gap-filling properties. The strong adhesion also allows the heat sink to be mounted vertically. Suitable for BGAs, stepper motor driver ICs and other semiconductor components requiring improved heat dissipation.
Specifications:
- Dimensions: 8.8 × 8.8 × 5 mm
- Material: Black anodized aluminium
- Mounting: Self-adhesive, with thermally conductive tape
