Product description
TermoGlue is a thermally conductive adhesive developed for mounting components with high heat emission, such as heat sinks, transistors, and memory chips. It combines excellent thermal conductivity (1.0 W/mK) with strong adhesive properties, ensuring a stable and durable bond even under thermal stress. The product is chemically safe for most materials and resistant to solvents, making it suitable for use in electronics and other equipment requiring both thermal transfer and strong adhesion.
The adhesive can be applied in layers up to 6 mm thick. Apply an even layer to a clean and dry surface before pressing the parts together. The curing time may vary depending on layer thickness and can take up to two days for thicker layers.
TermoGlue should be stored in a cool, dry place, protected from direct sunlight.
Specifications:
- Thermal conductivity: 1.0 W/mK
- Maximum layer thickness: 6 mm
- Hardness (Shore A): 45–75 A
- Solvent resistance: High
- Chemical compatibility: Safe for most materials
- Curing time: Up to 2 days (for thicker layers)
