Product description
QSPI DIP breakout board with the flash memory chip W25Q128. Provides an external QSPI flash for additional storage for e.g. RP2040, ESP32, or STM32. Converts the surface-mount SOIC-8 chip to DIP format for easy use in prototypes and on a breadboard. Supplied with header strip (not pre-soldered) to be soldered onto the board.
Specifications:
- Memory: 128 Mbit (16 MB) QSPI flash
- Chip: Winbond W25Q128JVSSIQ
- Interface: QSPI / SPI
- Supply voltage: 3.3 V
- Form factor: DIP-8
- Dimensions: 11.2 x 10.2 x 3.5 mm
