Product description
Heat sink made of black anodized aluminium with pre-applied thermally conductive tape for easy mounting on semiconductor devices. The tape acts as a thermal interface between the device and the heat sink and provides good thermal conductivity as well as cushioning and gap-filling properties. The strong adhesion also allows the heat sink to be mounted vertically. Suitable for CPUs, BGAs, stepper motor driver ICs and other semiconductor components requiring improved heat dissipation.
Specifications:
- Dimensions: 35 x 14 x 35 mm
- Material: Black anodized aluminium
- Mounting: Self-adhesive, with thermally conductive tape
