Product description
Two-component silicone potting compound for efficient heat dissipation and protection in electronic systems. Cures into a flexible barrier against moisture, dust, vibration, and temperature fluctuations.
Specifications:
- Content: 100 g (A + B)
- Thermal conductivity: 2 W/mK
- Working time: approx. 40 min at 23 °C
- Curing time: approx. 100 hours at room temperature
- Final hardness: ≥ 63 Shore A
- Consistency after curing: Elastic rubber mass
- Color: Grey
