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Epoxy encapsulating compound 100g

Art no: 41024124
TermoPasty AG - ART.AGT-224
Shop this product, Epoxy encapsulating compound 100g
price 149 SEK
Including 25% VAT

Mängdrabatt:
1package = 149:-2package = 268:205package = 596:-

Quantity discount
QuantityPrice
1 till 1
149 SEK
2 till 4
134.10 SEK
5 till
119.20 SEK
In stock, 54 package
Unit : Package

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Call +46 40 298760 (monday - friday 10AM - 4 PM CET) or email us on info@electrokit.se

Product description

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Product description

Epoxy Potting Compound 149 is a two-component, epoxy-based potting compound developed to protect and encapsulate electronics and circuit boards in enclosures. The compound forms a strong protective layer around components and circuit boards. It resists moisture, dust, chemicals, and mechanical stress (e.g. vibrations). The potting compound has excellent insulating properties and provides strong adhesion to a wide range of materials.

The product is used under demanding conditions, for example:

  • Protection of automotive electronics
  • Vibration and contamination protection for power tools and industrial electronics
  • Moisture protection for outdoor electronics
  • Encapsulation of marine electronics

Properties

  • Insulating properties: Provides reliable protection against electrical breakdown and short circuits
  • Chemical resistance: Withstands exposure to many aggressive chemicals, including acids and bases
  • Wide range of applications: Suitable for potting coils, transformers, capacitors, resistors, connectors, and cable ends
  • Strong adhesion: Bonds effectively to metals, plastics, and ceramics
  • Weather resistance: Retains its properties even under challenging temperature and weather conditions

Specifications

  • Mixing ratio: 100 parts base (A) to 12 parts hardener (B)
  • Pot life at 25 °C: Approx. 15–20 minutes

Curing time:

  • Mechanical strength: 7 days at room temperature
  • Chemical resistance: 14 days at room temperature
  • Final color after curing: Light yellow

Additional data:

  • Viscosity before curing: 20,000–30,000 cP at 25 °C
  • Density after mixing: 1.16 g/cm³ at 25 °C
  • Temperature resistance: Up to 100 °C

Instructions for use

  • Surface preparation: Clean surfaces from mechanical contamination using sandpaper and degrease with e.g. isopropanol.
  • Mixing: Thoroughly mix base (A) and hardener (B) in the ratio 100 parts base to 12 parts hardener.

 

Base:

Warning / Danger:
Contains: Diglycidyl ether of bisphenol A (2,2-Bis(4-glycidyloxyphenyl)propane)

Hazard statements:

  • H315: Causes skin irritation.
  • H317: May cause an allergic skin reaction.
  • H319: Causes serious eye irritation.
  • H411: Toxic to aquatic life with long lasting effects.

Precautionary statements:

  • P262: Do not get in eyes, on skin, or on clothing.
  • P264: Wash hands thoroughly after handling.
  • P273: Avoid release to the environment.
  • P280: Wear protective gloves/protective clothing/eye protection/face protection.

 

Hardener:

Warning / Danger:
Contains: Triethylenetetramine, Tetraethylenepentamine, 2-piperazin-1-ylethylamine,
Diethylenetriamine, 2-(2-Aminoethylamino)ethanol

Hazard statements:

  • H302+H312: Harmful if swallowed or in contact with skin.
  • H314: Causes severe skin burns and eye damage.
  • H317: May cause an allergic skin reaction.
  • H412: Harmful to aquatic life with long lasting effects.

Precautionary statements:

  • P261: Avoid breathing dust/fume/gas/mist/vapours/spray.
  • P262: Do not get in eyes, on skin, or on clothing.
  • P273: Avoid release to the environment.
  • P280: Wear protective gloves/protective clothing/eye protection/face protection.
  • P303+P361+P353: IF ON SKIN (or hair): Take off immediately all contaminated clothing. Rinse skin with water [or shower].
  • P305+P351+P338: IF IN EYES: Rinse cautiously with water for several minutes. Remove contact lenses, if present and easy to do. Continue rinsing.

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