Product description
Two-component potting compound for encapsulating components in electronics, telecommunications, and radio technology. After curing, it provides excellent electrical insulation as well as protection against moisture, acids, solvents (excluding acetone), and mechanical stress. See data sheet for more information.
Specifications:
- Content: 100 g (A + B in a weight ratio of 100:12)
- Working time: approx. 33 min at 25 °C
- Curing time: 7 days (mechanical strength), 14 days (chemical resistance)
- Final hardness: Solid body
- Temperature resistance: Up to 100 °C
- Color: Light yellow
- Resistance: Against water, bases, and several acids