Product description
Heat sink in aluminum for semiconductor components. The heat sink is mounted using thermally conductive tape or thermally conductive adhesive (not included). Suitable when improved heat dissipation is required from, for example, BGA ICs.
Specifications:
- Model: XDS - 282815
- Material: Aluminum
- Dimensions: 28 × 28 × 15 mm
- Material thickness: 4 mm
- Thermal resistance: 11 K/W